On June 23, the 2026 6th Global xEV Drive System Technology & Industry Summit grandly opened in Shanghai. The event was hosted by the Strategic Alliance for Technological Innovation of the Full Industrial Chain of EV Electric Drive Systems and the Electric Vehicle Committee of China Electrotechnical Society, and organized by NE Times.

As an influential annual summit focusing on China’s new energy vehicle electric drive industry, this exhibition saw Sun.King Pacific Semiconductors Technology (Zhejiang) Co., Ltd. ("SwissSem China") unveil its self-developed new-generation automotive-grade high-voltage SiC chips and newly packaged modules, drawing extensive attention from upstream and downstream manufacturers across the new energy vehicle industry chain.

The new-generation SiC MOSFETs developed independently by SwissSem China cover a full spectrum of voltage ratings, including 650V, 750V, 1200V, 1400V and higher withstand voltage grades. They match the mainstream 400V, 800V and even 1000V voltage platforms widely adopted in the new energy vehicle market. The ultra-low conduction loss of these devices significantly boosts the overall vehicle energy efficiency.

The continuous iteration and upgrading of new energy vehicles bring changes not only to voltage platforms, but also pose higher challenges to the packaging forms of power devices. During a special forum held alongside the summit themed Packaging Revolution – Progress of Embedded Packaging Technology, Mr. Ma Xiankui, Director of Technical Support & Marketing of SwissSem China, delivered a keynote speech titled Automotive Grade HighVoltage SiC Chips and Their Novel Packaging Applications, presenting high-efficiency product solutions tailored for automotive-grade scenarios.

For the emerging low-altitude aircraft sector, SwissSem China has launched the 1200V/2.2mΩ HEEV module, an ideal compact electric drive solution rated at 250kW. Featuring simple bridge press-plate mounting, flexible chip layout design for balanced current sharing, direct water cooling paired with high-performance ceramic substrates, and long power cycle lifespan thanks to the elimination of large-area welding layers, this SiC module meets the demands of application scenarios requiring high performance, high efficiency and small footprint.

In addition, SwissSem China has rolled out products compatible with mainstream industry packaging standards, including 1200V/600A IGBT modules, as well as 1200V/2mΩ and 1400V/2.75mΩ EVD series SiC modules. The six-in-one power modules adopt an innovative pin packaging process and design, which effectively cuts internal connection impedance and enhances the parallel performance of SiC chips. The 1400V devices deliver perfect compatibility with new-generation systems.

Amid the booming competition in the new energy vehicle market, SwissSem China keeps pace with the development trends of power semiconductors. Leveraging its outstanding chip design and manufacturing capabilities, the company continues to contribute its strength to the advancement of world’s new energy industry.