On July 4, the 16th Annual Automotive Powertrain Technology Conference (TMC2024) hosted by the China Society of Automotive Engineers was held in Qingdao. As China's most influential electric powertrain technology exchange platform, it attracted many new energy industry leaders, executives and experts to gather together, and nearly 2,000 automotive powertrain technology-related personnel attended the conference. As a core device and innovative technology enterprise in the new energy industry chain, SUN.KING was invited to attend the conference with its independently developed IGBT, SiC chips and modules.

The green and low-carbon development level of automotive products will directly determine the global competitiveness of the future automotive industry. The power system is the core of the green and low-carbon transformation of automobiles. Its innovation space for electrification, new energy, intelligence and control integration with other systems will be beyond imagination.  

Under this development trend, SUN.KING Semiconductor's self-developed IGBT, SiC chips and modules have attracted the attention and in-depth exchanges of many Chinese and foreign experts and scholars, and have received high attention and enthusiastic response from participants and customers.

SaiJing HEEV packaged SiC module (1200V)

HEEV packaged SiC modules are tailor-made for electric vehicle applications, suitable for 800V high-voltage platform applications, with an on-resistance as low as 2.0mΩ (@25℃), which can be used for electric drive systems up to 250kW and meet the needs of electric vehicle drive systems for high power, miniaturization and high reliability.

SUN.KING EVD packaged SiC module (1200V)

EVD packaged SiC module adopts the full-bridge package commonly used in the passenger car field. Through internal optimization design, it has excellent performance. Compared with the same specification packaged modules of the industry's leading companies, the on-resistance of SUN.KING EVD packaged SiC modules is 10% to 30% lower, the connection impedance is 33% lower, and the switching loss is similar or lower (same switching speed).

Not only that, SUN.KING Semiconductor's ED package IGBT module, EV package IGBT module, and ST package IGBT module also attracted great attention from the participants. It fully demonstrated SUN.KING's strong technical strength in the field of electric drive. With many years of outstanding practical performance and leading market position, it has won the praise of China's power electronics technology innovation and development and localization pioneer.