On November 9, the 2024 China Power Electronics and Energy Conversion Conference and the 27th Annual Academic Conference and Exhibition of the China Power Supply Society (CPEEC & CPSSC 2024) were held in Xi'an. The China Power Supply Society Academic Annual Conference and Exhibition is the largest and highest-level academic, technical and industrial event in China's power supply industry, with a history of more than 40 years. The conference aims to promote academic exchanges among scholars and related personnel at home and abroad in the fields of power electronics, energy conversion and power supply technology, promote cooperation between industry, academia and research, and promote technological innovation and progress in related industries and industrial chains.

As a core device and innovative technology enterprise in the new energy industry chain, SUN.KING Technology brought its independently developed IGBT, SiC chips and modules, as well as laminated bus bars and CCSs to the stage and delivered a keynote report.

At this conference, Ma Xiankui, technical support and marketing director of SUN.KING Semiconductor, delivered a speech on the theme of "High-reliability SiC chips and their application in automotive-grade compact packaging power modules", which received enthusiastic responses from participants.

SUN.KING Technology SiC MOSFET chip

SUN.KING Technology SiC MOSFET chip adopts a number of industry-leading special designs and processes, with low on-resistance, high reliability and good temperature characteristics.

Not only that, due to its excellent design and process, SUN.KING SiC MOSFET chips have shown excellent static and dynamic characteristics under high-temperature working conditions, and have reached the industry's first-class level of 1200V/13mΩ.

In addition, using this SiC MOSFET chip, SUN.KING Technology has also launched multiple specifications and models of automotive-grade, high-performance HEEV packaging, and EVD packaging SiC modules.

HEEV packaged SiC modules have the characteristics of low noise and small size, which can give full play to the performance of SiC chips and help customers realize the most compact electric drive up to 250kW.

EVD packaged SiC module products allow customers to learn from the system design of existing Si products to the greatest extent possible, while providing flexible business supply.

At the same exhibition, Suning exhibited i20 IGBT chips, ED packaged IGBT modules, ST packaged IGBT modules, BEVD packaged IGBT modules, EP packaged IGBT modules, HEEV packaged SiC modules, EVD packaged SiC modules, as well as laminated busbars and CCS products. It has received great attention from the technical experts and customers attending the meeting, and attracted the enthusiastic attention and in-depth exchanges of many participants and guests on site. It reflects the strong technical strength of SUN.KING in the field of power supply technology. With its world-class technical level and excellent performance, it has won unanimous recognition and high praise from domestic and foreign industry experts and customers.