From November 5 to 8, 2026, the 5th China Power Electronics and Energy Conversion Conference & Exhibition and the 29th Annual Conference of the China Power Supply Society (CPEEC & CPSSC 2026), organized by the China Power Supply Society (CPSS), were held at the Suzhou International Expo Centre. As the flagship annual event for the power electronics and power supply community in the Asia-Pacific region, this year's conference featured the deep integration of a "flagship conference + technical exhibition", with co-located events including PEAC 2026 and the Frontier Forum on Power Electronics, creating an industry exchange platform that brings together conferences, exhibitions, competitions and awards. Sun.King Pacific Semiconductors Technology (Zhejiang) Co., Ltd. (SwissSEM) presented its self-developed IGBT and SiC chips and power modules at Booth B1 D24, engaging in in-depth discussions with customers across the upstream and downstream value chain on applications such as new energy, energy storage and AI data center power supply.

As a major player in the global power semiconductor industry, Sun.King Pacific Semiconductors brought a full portfolio spanning IGBT and silicon carbide (SiC) chips and modules — from HEEV-package SiC modules for new energy vehicles to ED-package IGBT modules for industrial control — all developed in response to the industry's demand for high efficiency, high reliability and compact size. Within the first hour of the show's opening, dozens of new energy vehicle makers, energy storage companies and industrial equipment manufacturers from the Yangtze River Delta region had gathered at the booth to inquire about product performance and cooperation details, making it one of the most talked-about highlights of the opening day.

At the exhibition, the company presented power devices covering voltage ratings from 650 V to 2,300 V, drawing downstream customers, trade visitors, and university faculty and students to stop by and exchange ideas. The broad product portfolio and the diversity of application scenarios offered a concentrated showcase of the company's R&D achievements in self-developed chips and power modules.

Through the conference's supply–demand matchmaking sessions and exhibitor forums, Sun.King Pacific Semiconductors held in-depth discussions with customers from wind power, energy storage, data centers and industrial variable-frequency drives on topics including device selection, reliability validation and volume delivery schedules, further aligning customer requirements with the company's product solutions.

On the product front, the company's 1,700 V IGBTs hold a leading position among domestic brands in China's high-power SVG (Static Var Generator) sector; its 7th-generation i23-series chips and modules have entered the supply chains of leading Chinese commercial-vehicle electric-drive manufacturers; and its 2,300 V SiC products are currently progressing through testing with key customers.

Sun.King Pacific Semiconductors stated that it will continue to focus on self-developed chips and power modules, steadily advance product innovation and application validation, and provide verifiable, volume-ready, domestically developed device solutions for the new-type power system and computing infrastructure build-out.