In today's fast-evolving industrial landscape, high-efficiency power management and switching technology are critical to enabling smarter, more reliable, and energy-efficient systems. Among the most transformative components in this domain are Insulated Gate Bipolar Transistor (IGBT) modules—specifically, packaged IGBT modules. These modules have become the backbone of applications ranging from power distribution to electric transportation, and one company at the forefront of this revolution is SUN.KING Semiconductor.
Packaged IGBT modules are power semiconductor devices designed to efficiently manage large amounts of current and voltage in compact, durable enclosures. Their robust performance and integrated packaging design make them ideal for high-stress industrial environments.
From inverters and motor drives to renewable energy converters and electric vehicle powertrains, packaged IGBT modules have enabled significant leaps in efficiency, thermal management, and long-term reliability. These advantages are critical for achieving sustainability goals and reducing system-level operational costs across industries.
SUN.KING Semiconductor stands out as a leader in this transformation, offering domestically scarce and internationally advanced independent chip technology. Through years of innovation, the company has developed high-performance chipsets using:
Fine Groove Technology
Micro Groove Technology
Silicon Carbide (SiC) Technology
These cutting-edge technologies support three key voltage platforms—750V, 1200V, and 1700V—making them versatile enough to meet the needs of diverse power electronics applications.
Understanding the importance of application-specific performance, SUN.KING has launched its proprietary i20 IGBT and d20 diode chipsets. These are engineered with:
Trench Gate Technology in i20 IGBT chips for reduced conduction loss and improved switching efficiency.
Soft Recovery Technology in d20 diode chips for minimal reverse recovery losses and lower electromagnetic interference (EMI).
This unique combination ensures superior thermal and electrical characteristics, allowing SUN.KING’s packaged modules to perform exceptionally well in demanding industrial scenarios.
SUN.KING’s IGBT and SiC module product lineup includes:
ED Packaged IGBT Modules
ST Packaged IGBT Modules
BEVD Packaged IGBT Modules
EP Packaged IGBT Modules
HEEV Packaged SiC Modules
EVD Packaged SiC Modules
These modules are designed for integration into a wide range of systems and are widely deployed in:
Power Transmission and Distribution
New Energy and Renewable Power
Energy Storage Systems
Transportation Infrastructure
Industrial Automation and Manufacturing
Each packaging format is optimized for thermal performance, electrical isolation, and space efficiency, ensuring that industrial users can depend on these modules for long-term, high-reliability operation.
With the rise of SiC (Silicon Carbide) in power electronics, SUN.KING’s HEEV and EVD SiC packaged modules are opening up new possibilities for ultra-fast switching, higher voltage tolerance, and extreme thermal stability. These features make SiC modules ideal for next-generation applications such as high-speed rail, smart grids, and high-efficiency power conversion systems.
As industries demand more efficient, durable, and compact power solutions, the role of packaged IGBT and SiC modules becomes even more central. With pioneering technology and a commitment to innovation, SUN.KING Semiconductor is shaping the future of power electronics.
From power grids to electric mobility, SUN.KING’s advanced modules are not just components—they are the powerhouses driving industrial transformation.
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