On December 6, 2025, the “2025 China Power Supply Society New Energy Power Conversion Technology Forum,” hosted by the New Energy Power Conversion Technology Committee of the China Power Supply Society and organized by Sun.King Asia-Pacific Semiconductor Technology (Zhejiang) Co., Ltd., was grandly launched in Jiashan, Zhejiang. Experts and representatives from industry, academia, and research gathered together, guided by technology and grounded in practice, to jointly explore innovative pathways and new industrial opportunities in the field of new energy power conversion. Focusing on core domains such as power semiconductors, AI data-center power supply, wind power, hydrogen production, and energy storage, the forum attracted nearly 100 experts, corporate representatives, and industry guests.

At the opening ceremony, distinguished guests delivered speeches. Dr. Zhang Jinfa, Vice President of the China Power Supply Society, IEEE Fellow, and representative of Delta Electronics (Shanghai) Co., Ltd., extended warm congratulations on the successful opening of the forum. He affirmed the core value of power conversion technologies in promoting green and low-carbon transformation and expressed expectations for colleagues across industry, academia, and research to explore collaboratively and innovate together.

Prof. Zhang Xing, Chair of the New Energy Power Conversion Technology Committee of the China Power Supply Society, extended his warm welcome to all guests attending the forum. He noted that the vigorous development of the new energy industry has provided a broad stage for innovation in power conversion technologies. He emphasized that the committee remains committed to building an efficient exchange platform to gather industry insights and promote collaboration.

Mr. Jiang Jie, Chairman of Sun.King Technology Group, reviewed the company’s development journey in the power semiconductor field. He expressed sincere gratitude to the China Power Supply Society for its trust and support, to the committee for its guidance, and to all guests who traveled from afar. He stated that Sun.King Semiconductor has always regarded promoting industry progress as its mission and is willing to continue building bridges for industrial exchange, deepening cooperation, and fostering shared understanding with all sectors. Mr. Jiang wished the forum great success and hoped all guests would gain valuable insights, contributing jointly to the high-quality development of the new energy power-conversion industry.

This forum centered on “Building a Platform Linking Industry, Academia, Research, and Applications to Promote Innovation in Power Conversion Technologies,” focusing on technological opportunities and challenges amid the rapid development of the new energy industry. During the keynote sessions, Prof. Zhang Bo from the University of Electronic Science and Technology of China presented Power Semiconductor Technology and Industry Development Trends. Dr. Zhang Jinfa (IEEE Fellow) from Delta Electronics shared Trends and Challenges in Power Solutions for AI Data Centers. Experts from Windey Energy, Sungrow Hydrogen, New Shining Electronics, and other companies presented cutting-edge achievements in wind power, hydrogen production, and energy-storage systems, covering key segments of the new energy industry chain.

As the organizer of the forum, Sun.King Semiconductor not only built a communication platform linking industry, academia, research, and application, but also demonstrated its own practices and technological implementations. Guests visited Sun.King Semiconductor’s Jiashan production base, gaining close insight into the full process—from R&D and manufacturing to testing—of power semiconductor devices and observing the company’s industrial layout in the power-conversion field. Participants also exchanged ideas on module requirements and applications.

During the visit, Prof. Zhang Xing paid particular attention to and affirmed Sun.King Semiconductor’s outstanding industry performance among numerous semiconductor manufacturers. In response, Mr. Zhang Qiang, General Manager of Sun.King Semiconductor, attributed the company’s core competitiveness to four key initiatives: closely tracking market demand and technology development trends to guide R&D direction; maintaining strong communication with customers to capture key pain points and integrate them into product and service improvements; leveraging fast product-iteration capability and technological accumulation to meet diverse application scenarios; and establishing rapid-response mechanisms and high-quality customer service to build full-process support and strengthen trust. Moving forward, Sun.King Semiconductor will continue to uphold these four development principles, deepen innovation in the semiconductor field, and enhance services to consolidate its industry competitiveness.

During the discussion session, some guests focused on the development path of bonding-wire technology, raising questions about the evolution from aluminum wire to aluminum-clad copper and then to copper wire, prompting in-depth discussion. The Sun.King technical team, drawing on its own R&D practice, explained that the evolution of bonding-wire processes has always centered on three core objectives: performance enhancement, improved reliability, and adaptation to application scenarios. Regarding bonding-wire technology, Sun.King also noted that such requirements relate not only to the bonding-wire materials and processes themselves but are also closely linked to chip-process development. For example, SiC chips often undergo top-side copper plating to meet the requirements of the latest applications and process advancements.

Notably, during the technical-sharing session held on the same day, Mr. Sven, technical expert at Sun.King Semiconductor, delivered a presentation titled Development and Reliability of IGBT Power-Module Chips and Packaging Technologies. As a senior expert with many years of experience in the power-semiconductor field, he used real-world reliability statistics of the SISD0600ED120i20 module as the entry point to describe the technological upgrade path from the i20 to the i23 chip generations and the design implementation of their reliability. He further detailed key reliability indicators and assurances of ED-packaged IGBT modules. Finally, Mr. Sven shared Sun.King Semiconductor’s future plans, noting the company’s continuous deepening of cooperation with Sanan, enhancement of SiC product portfolios, advancement of XP-type and FP-type packaging development, and coverage of the 650 V–1700 V voltage range for photovoltaic, energy-storage, and other core applications. This company-visit activity not only showcased Sun.King Semiconductor’s technical accumulation and industry influence in the power-semiconductor field but also demonstrated the company’s commitment to core-technology breakthroughs and high-quality industrial development.

During the forum, experts exchanged perspectives—from industry trends in power semiconductors to power-supply innovations for AI data centers, from technological breakthroughs in wind-power systems to pathways for hydrogen production and energy storage. The topics aligned closely with the pulse of the new-energy industry. Through its dual role of organizing and presenting, Sun.King Semiconductor demonstrated both openness and technological depth: the factory visit grounded theoretical discussions in practical observation, while the technical presentations showcased real-world expertise—truly embodying the principle of integrating knowledge and action.

This forum, connected through technology, not only promoted knowledge sharing and the exchange of ideas in the field of new-energy power conversion but also, through Sun.King Semiconductor’s factory visit and technical presentations, illustrated the path from laboratory innovation to industrial implementation for power-semiconductor technologies. Moving forward, Sun.King Semiconductor will continue to deepen its work in power-semiconductor innovation and contribute to the high-quality development of the new-energy industry.