On September 12, Sunking Pacific Semiconductors Technology (Zhejiang) Co., Ltd （Swiss-Sem）and Hunan Sanan Semiconductor Co., Ltd. (“Hunan Sanan”) successfully held a strategic cooperation signing ceremony at Hunan Sanan’s headquarters. Leveraging their complementary advantages in the emerging power semiconductor ecosystem, the two parties have officially established a comprehensive strategic partnership. The collaboration will focus on the R&D and industrialization of wide bandgap semiconductor technologies such as SiC (Silicon Carbide) and GaN (Gallium Nitride), supporting the global energy revolution and industrial upgrading.

Complementary Strengths to Build a Collaborative Landscape

At the ceremony, Mr. Jiang Xielong, General Manager of Hunan Sanan, and Mr. Xiang Xie, Chairman of Sun.King Technology Group, delivered speeches. Mr. Jiang emphasized that Hunan Sanan is committed to providing full-process manufacturing for power semiconductors, while Sunking Semiconductor specializes in high-power chip design and module packaging. Their cooperation enables synergy across the entire industry chain—from chip design and manufacturing to packaging and application—creating a more resilient and competitive ecosystem.

Mr. Xiang highlighted that Hunan Sanan’s expertise in SiC materials, chip manufacturing, and packaging & testing is highly complementary to Sunking Semiconductor’s advantages in high-power chip design, module packaging, and market application. The partnership will accelerate the development and commercialization of next-generation SiC modules, delivering more efficient and reliable solutions for applications in new energy vehicles, photovoltaic energy storage, and industrial motors.

Technological Synergy Driving Innovation Breakthroughs

During the technical exchange session, Dr. Xu Zhiwei and Dr. Lars Knoll from both sides stated that joint efforts will focus on advanced topics such as high-temperature packaging materials, low-inductance module design, and double-sided cooling technologies. These innovations aim to enhance the performance, reliability, and power density of power modules, thereby promoting large-scale applications of semiconductor technologies in critical sectors.

Signing Ceremony Marks a New Stage of Collaboration

Mr. Zhang Qiang, Co-CEO of Sunking Semiconductor, and Mr. Zhang Zhenrong, Deputy General Manager of Hunan Sanan, formally signed the strategic cooperation agreement. The moment was jointly witnessed by Mr. Xiang and Mr. Jiang. With the exchange of commemorative gifts, the partnership entered a new stage of comprehensive advancement.

Through this strategic collaboration, both parties will integrate their strengths to focus on next-generation power semiconductor R&D, capacity synergy, and joint market development. Together, they aim to build a secure, controllable, and globally competitive high-end power semiconductor industry chain, contributing technological support to the worldwide transition toward green and low-carbon development.