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Sun.King Technology is pleased to announce its participation in PCIM Asia 2025, the leading international exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management.

In September 2025, Sun.King Technology Group Limited (0580.HK) announced that its Swiss subsidiary, Astrol Electronic AG (“Astrol”), has entered into a new collaboration with an award-winning innovator in the field of nuclear fusion. The customer will adopt Astrol’s industry-leading power switching solutions to control current in cutting-edge fusion systems.

On August 26, 2025, the group standard “Electrical Properties and Evaluation Methods of Metallized Film for DC Capacitors in Flexible DC Transmission Systems” (Project No. CESBZ2024018), led by Wuxi Sun.King Power Capacitor Co., Ltd. in collaboration with Tsinghua University, Xi’an High Voltage Apparatus Research Institute Co., Ltd., and 10 other leading enterprises in film-drawing and coating, successfully passed the final review organized by the China Electrotechnical Society.

​Sun.King Technology (580.HK, the “Group”) announced on July 13, 2025, that it has entered into a transaction involving the deemed disposal of equity interest in Sun.King Pcific Semiconductors Technology (Zhejiang) Co., Ltd (SwissSEM China) and the acquisition of equity interest in Hunan Hong’an Microelectronics Co., Ltd .

The i20 series 1200V 200A / 300A IGBT modules adopt a proven ST-case half-bridge topology, featuring excellent thermal cycling capability. By enabling an operating junction temperature of up to 175 °C, the modules significantly enhance power density, offering greater flexibility in thermal management design.

August 25, 2025 – Sun.King Technology Group Limited (“the Group” or “Sun.King Technology”) held its 2025 interim results online briefing, providing a comprehensive review of its financial and operational performance for the first half of the year.

The i23 1700V 900A series IGBT module adopts the classic ED package and incorporates i23 chips featuring micro-pattern trench gate technology, achieving ultra-low switching losses (Eon + Eoff) while delivering high short-circuit ruggedness to address challenges posed by high current density.

The i20 series TF modules adopt the industry-standard 34mm package and are available in 1700V 75A, 100A, and 150A ratings. Through optimized design, the series significantly enhances solder layer stability and process controllability, thereby improving temperature cycling reliability.