Search

The i20 series 1200V 200A / 300A IGBT modules adopt a proven ST-case half-bridge topology, featuring excellent thermal cycling capability. By enabling an operating junction temperature of up to 175 °C, the modules significantly enhance power density, offering greater flexibility in thermal management design.

August 25, 2025 – Sun.King Technology Group Limited (“the Group” or “Sun.King Technology”) held its 2025 interim results online briefing, providing a comprehensive review of its financial and operational performance for the first half of the year.

The i23 1700V 900A series IGBT module adopts the classic ED package and incorporates i23 chips featuring micro-pattern trench gate technology, achieving ultra-low switching losses (Eon + Eoff) while delivering high short-circuit ruggedness to address challenges posed by high current density.

The i20 series TF modules adopt the industry-standard 34mm package and are available in 1700V 75A, 100A, and 150A ratings. Through optimized design, the series significantly enhances solder layer stability and process controllability, thereby improving temperature cycling reliability.

The i23 900A/1200V series IGBT modules are engineered to significantly reduce saturation voltage drop and switching losses while meeting the industry's highest reliability standards.

Recently, Astrol, the Swiss subsidiary of Sun.King Technology, achieved a significant milestone by collaborating with renowned European maritime systems integrator Kongsberg Maritime.

On July 9, Sun.King Technology issued a profit alert, announcing that the Group expects to record revenue of approximately RMB 880 million for the reporting period, representing a year-on-year increase of around 34% compared to the same period in 2024.

The i23 series chip set adopts advanced micro-pattern trench IGBT technology, delivering lower saturation voltage (V_CE(sat)), higher current density, and reduced switching losses.